Research Facilties
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Facilities by Category
Ion Beam Analysis and processing
- Sensitive High Resolution Ion Microprobe I (SHRIMP I)
- Sensitive High Resolution Ion Microprobe II (SHRIMP II)
- Sensitive High Resolution Ion Microprobe RG (SHRIMP RG)
- High Energy Ion Beam Analysis
- SIMS (Secondary Ion Mass Spectrometer)
- Two Ion Implanters (low and high energy ion implanter)
- 14UD Pelletron 15 Million Volt Accelerator-Heavy Ion Beams
- Beam-Pulsing System
- Ion Source Sample Preparation Areas including clean rooms
- Multiple Sample Sputter-Cone Ion Source
- Single-Sample High-Current Sputter Ion Source
- Superconducting Modular Linear Accelerator-Heavy Ion Beams
- Plasma Deposition System with e-beam evaporation
- Plasma Etching System
- 10 keV Ion Implanter
- 5U NEC Pelletron Accelerator
- Cameca NanoSIMS 50 - High resolution ion probe, SE detector, O- and Cs+ sources, Multi-collection (5 isotopes).
Semiconductor Processing
- APCVD TiO2 deposition system (to come soon)
- IV testers
- LPCVD system for silicon nitride deposition
- Phosphorus (from POCl3) and Boron (from BBr3) diffusion and oxidation (wet and dry) furnaces (for wafers up to 125 mm diameter).
- Photoconductive decay contactless lifetime testers
- Rapid thermal oxidation furnace
- Saturated humidity cabinets
- Screenprinting and soldering equipment
- Solar cell measurement equipment for indoor and outdoor measurement of cells and modules
- Solar cell spectral response measurement system
- Spin rinser
- Two high speed dicing saws
- Two metal thermal evaporation systems
- Two photolithographic mask aligners and resist spinners (up to 4”)
- UV cabinet
- Dry Etching
- Electrical Measurements including Hall, IV, CV, DLTS
- Thin Film Deposition (resistive, e-beam, low-pressure chemical vapor deposition (LPCVD)and magnetron sputtering)
- Tube and Rapid Furnace Heating (RTA)
- Two Ion Implanters (low and high energy ion implanter)
- Two MOCVD Reactors (for III-V compound semiconductor multilayers) (metalorganic chemical vapour deposition)
- Custom laser direct write lithography system
- Czochralski crystal growth facility
- ExcelTeq SVG 8600 track coat/develop system
- Lithograph facilities (Karl Suss MA6 mask aligner)
- Oxford Plasmalab RIE 100 ICP dry etching system
- SCI Filmtek wafer mapper
- TEPLA plasma cleaner
- Thin film deposition (custom ultra-fast pulsed laser deposition facility; e-beam and sputter deposition systems)
- Plasma Deposition System with e-beam evaporation
- Plasma Etching System
- Sputter Deposition
- 10 keV Ion Implanter
- 5U NEC Pelletron Accelerator
- A clean room complex equipped with advanced instruments including a focused ion beam microscope, a UHV atomic force microscope, UV Raman spectrometer, keV focused ion beam microscope and electron microscopes
- Electrical Characterisation Laboratory
- Pulsed Laser Deposition System
- Facilities available at the department include equipment to study electronic properties of semiconductors under extreme conditions (ultra-low temperatures, high magnetic field, and high pressures), Mössbauer spectrometers, ac-susceptometers, nuclear magnetic resonance, magnetometers, photoluminescence spectrometers and a femtosecond laser system. Major facilities which researchers regularly access include nuclear reactors in Australia and overseas, the ISIS spallation neutron source (UK), and the world's largest cyclotron TRIUMF (Canada)
- Electrical Testing Facilities
- Material Synthesis and Device Fabrication Facilities: Polymer and general synthesis laboratory/Thin film deposition (vacuum and spin coating)/Class 3500 clean laboratory
- Solar Cell Testing facilities to AM1.5 Global Standard
- Device characterisation laboratory
- E-beam system - Used to deposit materials such as Si, SiNx, Al, Ti onto devices
- Mask aligning station, aligns features on a device to features on a mask
- Metallisation System - Used to thermally evaporate metals such as Au, Al, Cr, In
- Molecular Beam Epitaxy (MBE) - Used for epitaxial growth of HgCdTe semiconductor material
- Optical characterisation of semiconductor devices using Argon Ion and Titanium Sapphire lasers
- Photolithography room
- Reactive Ion Etching (RIE) machine, used to dry etch materials, and Plasma Enhanced Chemical Vapour Deposition (PECVD) used to deposit materials such as Si, SiN, SiON, SiC
- Wide Temperature Range "Cryostat" (42 - 700k) and DLTS System
- ZnS evaporator used in IR detector fabrication
Instrumentation and Mechanical/Electronic Workshop Equipment
- Electroplating equipment
- Advanced Manufacturing Laboratory
- Glass blowing - complex glass apparatus
- CAD Drafting and Design Facilities
- Lead Plating and Niobium Sputtering Facilities
- Small-jobs Workshop
- Vacuum Preparation areas
- Clayton Marine 6.8m commercially licenced boat under full survey, skipperd by fully qualified coxswain & crew and licenced to carry 7 people (2 crew and 5 passengers). Access to four aircraft, used principally for meteorological and atmospheric chemistry studies.
- Electronics Services
- 1500 watt CO2 CNC laser cutter
- 3D systems Actua 2100 rapid prototyping machine
- 60,000psi waterjet machine with 6 DoF positioning system
- Abrasive jet micro-machining facilities
- Access to a high speed high precision 5-axis CNC lathe
- Computer based surface finish analyser
- Coordinate Measuring Machine (CMM)
- Electric discharge machine
- Flexible manufacturing cell
- High speed and high precision 5-axis CNC machining centre with probe measuring capability
- Investment casting facility
- Kistler Dynamometers for force measurement in various machining processes
- Large rigid experiment lathe with continuously variable speed
- Plastic injection moulding machine
- Glass and Mechanical Workshops: Fully equipped glass-blowing workshop for customising/repairing apparatus. Extensive precision-engineering capabilities for instrument development including precision milling, large scale turning, vacuum welding. The workshops have built several highly successful instruments including mass spectrometers such as the oa-TOF mass spectrometer
- A number of units and facilities, including X-ray diffractometers; optical microscopes; image analyser; cutting, crushing, and grinding equipment; classification facilities; hot and cold metalworking equipment; pressing and mounting units; and laboratories for polishing, plating, welding, and computer applications.
- 25mm Gateway Screw Extruder and Film Blowing Tower
- Demag 80 Tonne Injection Moulding Machine
- Computer Aided Engineering Laboratories
- Manufacturing Engineering Laboratories
- Mechanic And Dynamic Laboratories
- Polymer Composite Facility: Injection moulding machines/Extruder/Ancillary Polymer equipment
- Robotic And Automation Laboratories
- Processing (Autoclave, Pultrusion, Injection Moulding, Hot Press)
- 3.0 kW portable diode laser (new)
- Various robots and automated welding rigs
- Various welding power sources for SMAW, GMAW, FCAW and SAW
X-Ray Analysis
- Cryo-equipment SEM, TEM and LM cold stages, Freeze-fracture,High Pressure Freezer, Propane Jet Freezer, Plunge freezing system, freeze-dryer (Scanning, Transmission, Electron Microscopy)
- Scanning Electron Microscopes (SEM): Cambridge 360, JEOL 6400, 6460, Hitachi 4500 field emission, 2250-N variable pressure with cathodoluminscence
- Transmission Electron Microscopes (TEM): Hitachi 7100, Philips 430. JEOL 2000EX, FEI CM300
- Single Crystal X-ray Diffraction Unit
- Electron microprobe (Cameca SX100) with 4 spectrometers, an EDS detector and full electron and X-ray imaging
- Inel XRG2500 Small-angle X-ray Scattering Apparatus
- X-Ray CT (Computed Tomography) Apparatus. - high resolution X-Ray microscope
- Double Crystal XRD (X-Ray Diffraction)
- Powder XRD (X-Ray Diffraction)
- Leybold LHS10 Electron Spectrometer for surface analysis by X-ray photoelectron spectrometry (XPS) and Auger Spectroscopy (AES).
- Rigaku XRD (X-ray Diffractometers) for analysis of bio molecules, Philips PW1010/80 and Philips PA2000 powder XRD (X-ray Diffractometers)
- X-ray Fluorescence Spectrometer
- analytical scanning electron microscope (SEM)
- Australian Synchrotron facility - 3GeV third-generation synchrotron
- A Scintag high resolution diffractometer with state of the art software
- Synchrotron-based analysis of proteins and nanostructures by a range of monochromatic light, from X-rays to infrared.
- State-of-the-art X-ray, laser and atom optics laboratories
- Surface Analysis: Kratos AXIS imaging XPS microprobe and Auger system. Kratos XSAM800 XPS. VG ESCALAB 220IXL imaging XPS microscope. Kratos LIMA/TOFSIMS microprobe.
- X-ray Diffraction: ENRAF-Nonius Turbo-CAD4 single crystal diffractometer. Philips X'Pert-MRD powder diffractometer.
- A number of units and facilities, including X-ray diffractometers; optical microscopes; image analyser; cutting, crushing, and grinding equipment; classification facilities; hot and cold metalworking equipment; pressing and mounting units; and laboratories for polishing, plating, welding, and computer applications.
- Microanalysis: Scanning Electron Microscopy/Transmission Electron Microscopy
- SEM (Scanning Electron Microscopy) Facilities
- Skyscan 1072 Micro-Computed Tomography (CT) X-Ray facility
- TEM (Transmission Electron Microscopy) JEOL 3000F is 300KV microscope
- Three Philips general purpose TEM (Transmission Electron Microscopes)
- Two XRD X-Ray Diffraction units (Theta/2Theta)
- VGSTEM is a dedicated High Resolution Analytical STEM
- XRF ED2000 (X-Ray Fluorescent unit)
- JEOL 2000FX TEM (Transmission Electron Microscope) Routine TEM imaging, Oxford Instruments EDS, STEM unit + 35mm camera auto-montaging system, selected area diffraction.
- JEOL 3000F FEGTEM Field Emission Gun Transmission Electron Microscope, BF/HAADF detectors + Oxford Instruments INCA EDS + GATAN image filter.
- JEOL 6300FESEM (Scanning Electron Microscope)
- JEOL 6400 microprobe Integrated WDS-EDS + CL + BSE detection + digital image capture system.
- JEOL 6400 SEM (Scanning Electron Microscope) Oxford Instruments ISIS EDS + CL + BSE + Digital image capture system.
- Philips 410 TEM (Transmission Electron Microscope)
- Philips 505 SEM (Scanning Electron Microscope) - EDAX EDS + BSE + Hexlands cryogenic stage + digital image capture system.
- Philips XL30 ESEM (Environmental Scanning Electron Microscopes) High vacuum + variable pressure + wet imaging + hot stage + Peltier cooled stage + BSE + SE.
- Zeiss 1555 VP FESEM (Environmental Scanning Electron Microscopes) High resolution + variable pressure + BSE, CL, Oxford Instruments EDS, In Lens SE detector.
- Powder X-ray diffraction (XRD)
- Single crystal X-ray diffraction (XRD)
- SEM (Scanning Electron Microscope) with EDS and EBSD (Electron Back-Scattered Diffraction)
- TEM (Transmission Electron Microscope) 200kV with EDS
- XRD (X-Ray Diffraction) 4 circles goniometer system
- XRD (X-Ray Diffraction) systems (powder, thin film and texture crystallography)
Electron and Optical Microscopy and Microanalysis
- Cryo-equipment SEM, TEM and LM cold stages, Freeze-fracture,High Pressure Freezer, Propane Jet Freezer, Plunge freezing system, freeze-dryer (Scanning, Transmission, Electron Microscopy)
- Focused Ion Beam: Orsay Physics Camion (Gallium ion beam) on JEOL 6460 Scanning Electron Microscope (SEM)
- Light Microscopes: Zeiss Axioskop, Wild M400, Leitz Ortholux Epifluorescence, Nikon Labophots, small dissecting microscopes. Spectrometer, Iatia Quantitative Phase System, temperature-controlled stage.
- Scanning Electron Microscopes (SEM): Cambridge 360, JEOL 6400, 6460, Hitachi 4500 field emission, 2250-N variable pressure with cathodoluminscence
- Transmission Electron Microscopes (TEM): Hitachi 7100, Philips 430. JEOL 2000EX, FEI CM300
- Bruker A590 infrared microscope
- CM300 FEI electron microscope
- Electron microprobe (Cameca SX100) with 4 spectrometers, an EDS detector and full electron and X-ray imaging
- Kodak MegaPlus CCD camera ES310/T, Roper Scientific (MASD) High speed camera
- Optical Microscopy
- Scanning Probe and Optical Microscopes for studying Crystal Growth
- Electron Microscopy
- Metallographic Preparation and optical microscopy laboratory
- analytical scanning electron microscope (SEM)
- analytical scanning transmission electron microscope (ASTEM)
- analytical transmission electron microscope(ATEM)
- atom probe field ion microscope (APFIM)
- Atomic scale imaging (Transmission electron microscopy, STM, in vacuum, air and at different temperatures)
- Leica Time-Correlated Single Photon Counting Confocal Fluorescence Microscope
- Olympus IX71 Digital Widefield Fluorescence Microscope
- A clean room complex equipped with advanced instruments including a focused ion beam microscope, a UHV atomic force microscope, UV Raman spectrometer, keV focused ion beam microscope and electron microscopes
- Microscopes with video adapter for electronic imaging and measuring
- University Electron Microscope Unit: Hitachi S900 and S4500 Field Emission SEM, Cameca SX50 Microprobe, Hitachi H7000 TEM, and Phillips CM200 Field Emission Gun TEM.
- A number of units and facilities, including X-ray diffractometers; optical microscopes; image analyser; cutting, crushing, and grinding equipment; classification facilities; hot and cold metalworking equipment; pressing and mounting units; and laboratories for polishing, plating, welding, and computer applications.
- Physical Metallurgy: Equipment for sample preparation, microscopy, and mechanical characterisation.
- Microanalysis: Scanning Electron Microscopy/Transmission Electron Microscopy
- Confocal fluorescence microscope system/Fluorescence imaging/Bright field optical microscopy
- Fluorescence spectrophotometer/Absorption spectrophotometer/Confocal fluorescence microscope system
- BIO-RAD MRC-600 laser scanning confocal microscope
- BIO-RAD Radiance Plus confocal microscope
- Iatia QPm™ phase contrast image capture, analysis and enhancement system.
- Leica TCS SPII multi-photon microscope
- Nikon C1 – LIMO confocal microscope with fluorescence lifetime imaging
- Nikon Eclipse E800 fluorescence microscope (SensiCam)
- Olympus BX60 Light Microscope
- Olympus BX61 motorized system microscope (SIS)
- PicoSPM from Molecular Imaging (multi-purpose scanning probe microscope: AFM/SPM)
- SEM (Scanning Electron Microscopy) Facilities
- TEM (Transmission Electron Microscopy) JEOL 3000F is 300KV microscope
- Three Philips general purpose TEM (Transmission Electron Microscopes)
- VGSTEM is a dedicated High Resolution Analytical STEM
- Zeiss Axioplan (Kontron)
- Zeiss Axioskop 2 MAT Light Microscope
- Zeiss Axioskop Reflecting Light Microscope
- Material Characterisation (DMA & DSC, C-Scanner, Colour Image Analysis System, Optical Microscopes)
- Biological TEM (Transmission Electron Microscope) imaging.
- BioRad MRC1000 Confocal Microscope - Digital image analysis + reconstruction software.
- JEOL 2000FX TEM (Transmission Electron Microscope) Routine TEM imaging, Oxford Instruments EDS, STEM unit + 35mm camera auto-montaging system, selected area diffraction.
- JEOL 3000F FEGTEM Field Emission Gun Transmission Electron Microscope, BF/HAADF detectors + Oxford Instruments INCA EDS + GATAN image filter.
- JEOL 6300FESEM (Scanning Electron Microscope)
- JEOL 6400 microprobe Integrated WDS-EDS + CL + BSE detection + digital image capture system.
- JEOL 6400 SEM (Scanning Electron Microscope) Oxford Instruments ISIS EDS + CL + BSE + Digital image capture system.
- Leica Multi-photon Confocal Microscope
- Philips 410 TEM (Transmission Electron Microscope)
- Philips 505 SEM (Scanning Electron Microscope) - EDAX EDS + BSE + Hexlands cryogenic stage + digital image capture system.
- Philips XL30 ESEM (Environmental Scanning Electron Microscopes) High vacuum + variable pressure + wet imaging + hot stage + Peltier cooled stage + BSE + SE.
- Zeiss 1555 VP FESEM (Environmental Scanning Electron Microscopes) High resolution + variable pressure + BSE, CL, Oxford Instruments EDS, In Lens SE detector.
- Zeiss Axioplan 2 - Microscope Fluorescence + Nomarski interference contrast + phase contrast + Axiocam digital camera.
- Laser Scanning Confocal Microscope
- SEM (Scanning Electron Microscope) with EDS and EBSD (Electron Back-Scattered Diffraction)
- TEM (Transmission Electron Microscope) 200kV with EDS
Thin Film Deposition, Coating and Processing
- APCVD TiO2 deposition system (to come soon)
- Electroplating equipment
- Filmetrics dielectric thickness measurement system
- LPCVD system for silicon nitride deposition
- Thin Film Deposition (resistive, e-beam, low-pressure chemical vapor deposition (LPCVD)and magnetron sputtering)
- Two MOCVD Reactors (for III-V compound semiconductor multilayers) (metalorganic chemical vapour deposition)
- Thin film deposition (custom ultra-fast pulsed laser deposition facility; e-beam and sputter deposition systems)
- Thin Film Techniques Laboratory
- Vacuum Evaporation Systems
- Reactive Ion Etching (RIE) machine, used to dry etch materials, and Plasma Enhanced Chemical Vapour Deposition (PECVD) used to deposit materials such as Si, SiN, SiON, SiC
- Filtered Arc PVD (Physical Vapour Deposition)
Plasma Processing
- custom built Water Plasma reactor
- Oxford Plasmalab RIE 100 ICP dry etching system
- TEPLA plasma cleaner
- Atmospheric Pressure Plasma Surface Modification
- Plasma Deposition System with e-beam evaporation
- Plasma Etching System
- Reactive Ion Etching (RIE) machine, used to dry etch materials, and Plasma Enhanced Chemical Vapour Deposition (PECVD) used to deposit materials such as Si, SiN, SiON, SiC
Mechanical Testing and Analysis
- Instron Laboratory
- Nanoindentation (Ultra-Micro Indentation System (UMIS) and triboindenters)
- Charpy V-notch impact toughness tester
- Mohr and Fedorhaf universal testing machine (100 kN capacity)
- MTS 20/G electromechanical testing system (100 kN capacity)
- MTS 810 servohydraulic testing system (350 kN capacity)
- Schenck rotating-bending fatigue testing machine
- Creep Testing Rigs
- Dynamic Mechanical Thermal Analysis (DMTA)
- Stress Corrosion Cracking Testing Facilities
- Stress Relaxation and Creep apparatus
- Tensile Properties of Thin Films
- Fracture, Failure and Wear: Two servo-hydraulic universal testing machines (250 kN capacity), screw machine (100 kN capacity), high-temperature testing furnace (1000oC), Charpy impact tester, indentation microhardness testers, Taber abrasers, pin-on-disk tribometer, high-stress pin-on-drum abrasion wear tester, and low-stress rubber wheel wear tester (ASTM standard).
- Physical Metallurgy: Equipment for sample preparation, microscopy, and mechanical characterisation.
- Mechanical Testing (Universal Testing Machines, Hydraulic Servo-Pulser, Impact Testing Machines)
- Hardness testing (macro to 1mg)/Mechanical testing (tensile and compression)/Charpy impact testing/Access to fatigue and creep testing facilities/Wear testing ( abrasive, rolling contact fatigue and sliding to 600°C)
- UMIS (Ultra-Micro Indentation System) microhardness test machine (min. 1mg load)
Particle / Colloid Preperation and Analysis
- Powder XRD (X-Ray Diffraction)
- Reactive Ball Milling
- Malvern High Performance Partile Size analyser, Nima Langmuir Blodgett Trough 611, Sentech Instruments SE400 elipsometer.
- Rigaku XRD (X-ray Diffractometers) for analysis of bio molecules, Philips PW1010/80 and Philips PA2000 powder XRD (X-ray Diffractometers)
- Malvern HPPS particle sizer (DLS) Dynamic light scattering
- Malvern Zetasizer (Particle sizer)
- A Dantec Particle Image Velocimeter (PIV)
- A Non-Spherical Particle Size Analyser (NSPA)
- A Particle Density Monitor.
- An Aerometrics Phase Doppler Spherical Particle Analyser (PDSP)
- X-ray Diffraction: ENRAF-Nonius Turbo-CAD4 single crystal diffractometer. Philips X'Pert-MRD powder diffractometer.
- Ceramics: Freeze and rotary evaporation driers; a wide range of wet and dry milling and mixing units; ultrasonic dispersion units; rheometers; a full range of resistance, induction, and proportional-power microwave furnaces; autoclave; differential thermal and thermogravimetric analysers; differential scanning calorimeter; dilatometers; and ultra-low vacuum sessile drop unit.
- Particulate Science and Technology: Range from a simple apparatus for fluid drag force measurement to complex rigs to simulate powder-liquid-gas flow with moving particles in blast furnace conditions. There also is access to a variety of computers for modelling and data processing applications.
- Malvern Particle Sizer
- Nanoparticle production and analysis capabilities
- Capillary Rheometer for Solutions and Suspensions
- Powder X-ray diffraction (XRD)
- Reactive ball mills/Spark discharge mechanical milling/Rolling mills/Wire drawing machine
- Particle size analyser 0.05-900 µm
- XRD (X-Ray Diffraction) systems (powder, thin film and texture crystallography)
Crystal Growth (bulk, thin film, wire and dot)
- Two MOCVD Reactors (for III-V compound semiconductor multilayers) (metalorganic chemical vapour deposition)
- Czochralski crystal growth facility
Surface and Near-Surface Analysis and Equipment
- Mk4 SFA (Surface Forces Apparatus) with Friction Attachment and Capacitance Attachment
- Surface Functionalization Bio-interface
- Leybold LHS10 Electron Spectrometer for surface analysis by X-ray photoelectron spectrometry (XPS) and Auger Spectroscopy (AES).
- Surface Area Measurement Instrumentation
- Computer based surface finish analyser
- Surface Analysis: Kratos AXIS imaging XPS microprobe and Auger system. Kratos XSAM800 XPS. VG ESCALAB 220IXL imaging XPS microscope. Kratos LIMA/TOFSIMS microprobe.
Optical Spectroscopies, Testing and Analysis
- Bruker IFS28 infrared spectrometer
- Optical characterisation and testing including photoluminescence
- Cary 5000 UV-Vis-IR spectrophotometer
- Clark MXR CPA 2001 femtosecond Ti:sapphire laser with Light Conversion TOPAZ optical parametric generator
- Shimadzu UV-Vis-IR spectrophotometer
- FTIR (Fourier Transform Infrared) spectrometer
- Assortment of lasers spectrometers and associated equipment are used to probe fast gas phase reactions and other spectroscopic studies
- Atomic Absorption Spectrophotometers
- DeltaNu Advantage 200A Spectrometer (Raman Spectrophotometer)
- Fourier Transform Infrared Spectrophotometers
- Fluorolog Horiba Fluorescence Spectrophotometer
- Fourier-transform infrared spectroscopy
Mass Spectrometry
- Agilent/HP 6890/5973 GC-MS (Mass Spectrometer)
- Bruker Apex 4.7T FTICR-MS (Mass Spectrometer)
- Micromass TofSpec-2e MALDI-TOF MS (Mass Spectrometer)
- Micromass-Waters LC-ZMD single quadrupole liquid chromatograph-MS (Mass Spectrometer)
- VG AutoSpec M series sector (EBE) MS (Mass Spectrometer)
- VG Quattro II triple quadrupole MS (Mass Spectrometer)
- VG ZAB-2SEQ hybrid sector (BEqQ) MS (Mass Spectrometer)
- Excimer Laser Ablation ICP-MS (Inductively Coupled Plasma Mass Spectrometers)
- Finnigan MAT261 mass spectrometers
- Fisons VG ICP-MS (Inductively Coupled Plasma Mass Spectrometers)
- four mass-spectrometers
- HP7500 Agilent VG ICP-MS (Inductively Coupled Plasma Mass Spectrometers)
- Inductively Coupled Plasma Mass Spectrometry, both Solution and Laser Ablation
- Multi-collector Inductively Coupled Plasma Mass Spectrometry, both Solution and Laser Ablation
- Neptune Multicollector Inductively Coupled Plasma Mass Spectrometer (MC-ICP-MS)
- thermal ionisation mass spectrometers
- TRITON multi-collector mass spectrometers
- SIMS (Secondary Ion Mass Spectrometer)
- Beam-Line 5; Enge Split-pole Spectrometer/ AMS selection system
- Inductively Coupled Plasma Mass Spectrometry
- 1 x Finnigan GCQ mass spectrometer (LG04)
- 1 x Finnigan LCQ mass spectrometer (LG04)
- 1 x Micromass Q-TOF2 mass spectrometer (LG04) - owned by a Research Consortium
- 1 x VG ZAB 2HF mass spectrometer (LG04)
- Mass Spectrometry: Bruker APEXII FTICR (electron ionization, MALDI and electrospray). VG Quattro (electron ionization, chemical ionization, electrospray, GC-MS) plus quadrupole and TOF instruments.
- Iron, Steel and Alloy Processes: Iron smelting induction furnace with 50 kg capacity and on-line mass spectrometer, two thermogravimetric analysers with 100 g and 1700oC limits, processing facilities for studying solid-gas reactions with on-line mass spectrometer, and a dual-zone furnace (1300o and 1700oC) for work with metals of high volatility.
- Cameca NanoSIMS 50 - High resolution ion probe, SE detector, O- and Cs+ sources, Multi-collection (5 isotopes).
- Gas Chromatography/Mass Spectrometry
Nuclear Technology and Analysis
- Gamma spectrometry
- 14UD Pelletron 15 Million Volt Accelerator-Heavy Ion Beams
- BaF2; 4-element Detection System and Irradiation station
- Beam-Line 1; CAESAR- Compton Suppressed Gamma-Ray Array
- Beam-Line 2; General Purpose line & Hyperfine Spectrometer
- Beam-Line 3; 2-metre Scattering Chamber, Hybrid Particle Detectors
- Beam-Line 4; General purpose line
- Beam-Line 5; Enge Split-pole Spectrometer/ AMS selection system
- Beam-Line 6; Superconducting Electron Solenoid/Specroscopy System
- Beam-Line 7; Wien Filter; AMS Detection System
- Beam-Line A; CUBE Fission Detector System
- Beam-Line B; SOLITAIRE Superconducting Transport System
- Beam-Line C; Megha Array and Vacuum Chambers
- Beam-Pulsing System
- Multiple Sample Sputter-Cone Ion Source
- Single-Sample High-Current Sputter Ion Source
- Superconducting Modular Linear Accelerator-Heavy Ion Beams
- VME-based High-Speed Data Acquisition and Analysis System
AFM / STM facilities
- Atomic Force Microscope and Scanning Tunnelling Microscope
- Atomic Force Microscopy (AFM)
- NanoScope III Atomic Force Microscope
- Scanned Probe Microscope (SPM) - 3D Molecular Force Probe
- Access to Electron Microscopy and Atomic Force Microscopy (AFM) Facilities
- Scanning Probe and Optical Microscopes for studying Crystal Growth
- Nanoscope IV, MultiMode, Scanning Probe Microscopy system from Digital Instruments
- Asylum MFP-3D Atomic Force Microscope
- Atomic scale imaging (Transmission electron microscopy, STM, in vacuum, air and at different temperatures)
- A clean room complex equipped with advanced instruments including a focused ion beam microscope, a UHV atomic force microscope, UV Raman spectrometer, keV focused ion beam microscope and electron microscopes
- Jeol AFM/STM UHV Scanning Probe System
- Access to Electron Microscopy and Atomic Force Microscopy (AFM) Facilities
- AFM Park Scientific Instruments
- PicoSPM from Molecular Imaging (multi-purpose scanning probe microscope: AFM/SPM)
- Scanning Probe Microscope
- Atomic Force Microscope / Nanomanipulator System
Polymer Production and Processing
- Plastic injection moulding machine
- Biomaterials: range of processing and characterisation equipment for the study of ceramic, metallic, and polymeric devices.
- Polymers: Two micro-Raman spectrometers (514, 633, and 780 nm laser excitation frequencies) plus a full range of accessories, differential scanning calorimeter, and injection moulder.
- Polymer Synthesis and Characterisation
- Capillary Rheometer for Plastics
- Demag 80 Tonne Injection Moulding Machine
- Slit Rheometer for Plastics
- Material Synthesis and Device Fabrication Facilities: Polymer and general synthesis laboratory/Thin film deposition (vacuum and spin coating)/Class 3500 clean laboratory
- Polymer Composite Facility
- Polymer Composite Facility: Injection moulding machines/Extruder/Ancillary Polymer equipment
Chemical Synthesis, Processing and Analysis
Thermal and High Pressure Synthesis, Processing and Analysis
- Phosphorus (from POCl3) and Boron (from BBr3) diffusion and oxidation (wet and dry) furnaces (for wafers up to 125 mm diameter).
- Rapid thermal oxidation furnace
- Furnaces with controlled atmospheres
- Solid Media High Pressure Equipment - Piston-cylinder apparatuses, Multi-anvil apparatuses, Furnaces with controlled atmospheres
- Thermal Analysis and Thermogravimetry
- Tube and Rapid Furnace Heating (RTA)
- Glass chemistry laboratory for chalcogenide glasses (rocking and tube furnaces)
- Thermal Analysis Laboratory
- Thermogravimetric Analysis (TGA)
- Bel Jetlow K2 Chamber Furnace (with Shimaden FP93 Controller)
- Black Coal Utilisation: Vertical and horizontal furnaces (1700oC), hot press for briqueting, on-line mass spectometer, high-frequency induction furnace, CCD cameras and image analysis software for sessile drop measurements, and carbon/nitrogen/oxygen/sulphur determination units.
- Ceramics: Freeze and rotary evaporation driers; a wide range of wet and dry milling and mixing units; ultrasonic dispersion units; rheometers; a full range of resistance, induction, and proportional-power microwave furnaces; autoclave; differential thermal and thermogravimetric analysers; differential scanning calorimeter; dilatometers; and ultra-low vacuum sessile drop unit.
- Fracture, Failure and Wear: Two servo-hydraulic universal testing machines (250 kN capacity), screw machine (100 kN capacity), high-temperature testing furnace (1000oC), Charpy impact tester, indentation microhardness testers, Taber abrasers, pin-on-disk tribometer, high-stress pin-on-drum abrasion wear tester, and low-stress rubber wheel wear tester (ASTM standard).
- High-Temperature Materials: Ambient and controlled-atmosphere furnaces (1300oC) used in conjunction with a wide range of thermogravimetric analysers, including a Cahn D200 thermobalance (0.1 mg sensitivity, 3.5 g capacity), cyclic oxidation rigs, gas mixing systems, and arc melting equipment for alloy preparation.
- Iron, Steel and Alloy Processes: Iron smelting induction furnace with 50 kg capacity and on-line mass spectrometer, two thermogravimetric analysers with 100 g and 1700oC limits, processing facilities for studying solid-gas reactions with on-line mass spectrometer, and a dual-zone furnace (1300o and 1700oC) for work with metals of high volatility.
- Thermogravimetric analysis
- Various heat treatment furnaces
Ceramics and Composites Processing
- Biomaterials: range of processing and characterisation equipment for the study of ceramic, metallic, and polymeric devices.
- Ceramics: Freeze and rotary evaporation driers; a wide range of wet and dry milling and mixing units; ultrasonic dispersion units; rheometers; a full range of resistance, induction, and proportional-power microwave furnaces; autoclave; differential thermal and thermogravimetric analysers; differential scanning calorimeter; dilatometers; and ultra-low vacuum sessile drop unit.
- Composites: Comprehensive range of equipment for the characterisation and testing (20o-100oC) of composites. Sample preparation equipment includes a platen hot press (300oC) and casting facilities.
- Electronic and Superconducting Ceramics: Equipment for the measurement of d.c. electrical resistivity, a.c. magnetic susceptibility, and Hall Effect (all 77-300 K); electromagnet (2 T); superconducting magnet (7 T); and pilot plant for continuous fabrication of coated tapes.
- Polymer Composite Facility
- Polymer Composite Facility: Injection moulding machines/Extruder/Ancillary Polymer equipment
Electrical and Electronic Testing and Analysis
- High frequency and quasistatic CV tester
- Electrical Measurements including Hall, IV, CV, DLTS
- d.c. conductivity, Thermally Stimulated Current (TSC) and Thermally Stimulated Depolarisation
- Electronic and Superconducting Ceramics: Equipment for the measurement of d.c. electrical resistivity, a.c. magnetic susceptibility, and Hall Effect (all 77-300 K); electromagnet (2 T); superconducting magnet (7 T); and pilot plant for continuous fabrication of coated tapes.
- Facilities available at the department include equipment to study electronic properties of semiconductors under extreme conditions (ultra-low temperatures, high magnetic field, and high pressures), Mössbauer spectrometers, ac-susceptometers, nuclear magnetic resonance, magnetometers, photoluminescence spectrometers and a femtosecond laser system. Major facilities which researchers regularly access include nuclear reactors in Australia and overseas, the ISIS spallation neutron source (UK), and the world's largest cyclotron TRIUMF (Canada)
- Wide Temperature Range "Cryostat" (42 - 700k) and DLTS System
Composition Analysis
- Carlo Erba 1106 automatic analyser
- Dionex Ion Chromatography Analyser
- Five High Performance Liquid Chromatography (HPLC) systems
- High Energy Ion Beam Analysis
- SIMS (Secondary Ion Mass Spectrometer)
- Gas Chromatography Laboratory
- Liquid and Ion Chromatography Laboratory
- Gas Chromatographs
- High Pressure Liquid Chromatographs
- Ion Chromatographs
- atom probe field ion microscope (APFIM)
- Gel Permeation Chromatography
Manufacturing Equipment
- Electroplating equipment
- 3.0 kW portable diode laser (new)
Note: Recently added facilities may only be available through the search feature.
